| 摘要 |
A flat zone-cum-groove wafer type wafer aligner according to the present invention includes a cassette (10) that is removably formed in a frame (1) and has partition walls (11) formed; a wafer rotating portion (20) that is disposed in a longitudinal direction in the frame (1), where a rotating roller (21), which rotates a wafer (W) in contact with a lower end of the wafer, is provided to be mounted on a rotating shaft (25); a stop portion (30) that is configured to have a long plate-shaped flat zone step portion (31) which is formed on one side of the rotating roller (21) with a tip end portion (31a) being formed to be horizontal to the rotating shaft (25), and a groove step portion (35) which is formed on the other side of the rotating roller (21) with a long step rod (36) being provided to be horizontal to the rotating shaft (25); a first rotating driving unit (40) that rotates the rotating shaft (25) by using the power of a first motor (M1); and a second mode converting unit (50) that rotates the stop portion (30) by using the power of a second motor (M2) or an actuator so that the stop portion (30) is positioned in at least one of a neutral mode (S1), a flat zone step mode (S2), and a groove step mode (S3). [Reference numerals] (2) Vertical frame plate |
