| 摘要 |
The present invention relates to a process for manufacturing packing of a flexible substrate and, more specifically, to completing the process for manufacturing the packing of the flexible substrate through an order such as entire manufacturing processes, load, packing, unload, and laser. The present invention is provided to install a load weight stiffening plate on the flexible substrate to decrease the generation of bending and deformation in the process for manufacturing the packing, thereby accurately completing a packing process of a chip. The present invention is provided to effectively increase an amount ratio of the process for manufacturing the packing of the chip, thereby reducing manufacturing costs. A packing structure of the flexible substrate is installed by connecting a conductive material and the flexible substrate on the upper part and the lower part of a flexible load plate. An external boundary frame is formed on the flexible substrate. A chip substrate is formed into the external boundary frame in a plurality of square array formations. A plurality of chips is installed on the chip substrate and is covered by a thermosetting material. [Reference numerals] (10) All manufacturing processes; (11) Load; (12) Laser; (13) Packing |
