发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
摘要 |
According to one embodiment of the present invention, provided is a light emitting device package which includes: a package body; at least one electrode pattern arranged on the package body; at least one light emitting device electrically connected to the electrode pattern; a heat radiation unit inserted into the package body and thermally in contact with the light emitting device; and a crack preventing unit arranged on the heat radiation unit. An open area is formed inside the crack preventing unit. The light emitting device is arranged in the open area. |
申请公布号 |
KR20140039740(A) |
申请公布日期 |
2014.04.02 |
申请号 |
KR20120106341 |
申请日期 |
2012.09.25 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
KIM, BYUNG MOK;KANG, BO HEE;KIM, HA NA;KODAIRA HIROSHI;TANDA YUICHIRO;OZEKI SATOSHI |
分类号 |
H01L33/48;H01L33/54;H01L33/64 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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