发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 According to one embodiment of the present invention, provided is a light emitting device package which includes: a package body; at least one electrode pattern arranged on the package body; at least one light emitting device electrically connected to the electrode pattern; a heat radiation unit inserted into the package body and thermally in contact with the light emitting device; and a crack preventing unit arranged on the heat radiation unit. An open area is formed inside the crack preventing unit. The light emitting device is arranged in the open area.
申请公布号 KR20140039740(A) 申请公布日期 2014.04.02
申请号 KR20120106341 申请日期 2012.09.25
申请人 LG INNOTEK CO., LTD. 发明人 KIM, BYUNG MOK;KANG, BO HEE;KIM, HA NA;KODAIRA HIROSHI;TANDA YUICHIRO;OZEKI SATOSHI
分类号 H01L33/48;H01L33/54;H01L33/64 主分类号 H01L33/48
代理机构 代理人
主权项
地址