| 摘要 |
Disclosed is a mold clamping apparatus that uses an electromagnet to effect a mold clamping force. The apparatus is equipped with an electromagnet holding member that holds the electromagnet, an attraction member having a first attraction surface, which is attracted by said electromagnet, and a contact-prevention part to prevent full-surface contact of the magnetic materials between the first attraction surface and a second magnetic attraction surface opposite said attraction surface on said electromagnet holding member. In this way, it is possible to provide a mold clamping apparatus that can facilitate separation of the members attracted by the residual magnetic field of the electromagnet used for generating the mold clamping force. |
