发明名称 Method for protecting a component, method for laser boring and component
摘要 Protecting a component during a laser machining, preferably laser drilling of the component with a hollow space (10), comprises: making a through-hole (19) through a wall (16) of the hollow space of the component; and filling the hollow space with Teflon (RTM: Polytetrafluoroethylene) powder at least in the region of the area to be machined. The Teflon (RTM: Polytetrafluoroethylene) powder is introduced into the hollow space with a gelling agent, preferably gelatine. Independent claims are also included for: laser drilling a component, comprising making a through-hole through a wall of a hollow space of the component, and protecting the hollow space; and a hollow component (1), comprising Teflon (RTM: Polytetrafluoroethylene) powder and gelling agent introduced into in a hollow space of the hollow component.
申请公布号 EP2712699(A1) 申请公布日期 2014.04.02
申请号 EP20120186769 申请日期 2012.10.01
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 DEGEL, CHRISTOPHER;MASSA, ANDREA;WILKENHOENER, ROLF;WOLLNIK, ADRIAN
分类号 B23K26/38 主分类号 B23K26/38
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