发明名称 |
Method for protecting a component, method for laser boring and component |
摘要 |
Protecting a component during a laser machining, preferably laser drilling of the component with a hollow space (10), comprises: making a through-hole (19) through a wall (16) of the hollow space of the component; and filling the hollow space with Teflon (RTM: Polytetrafluoroethylene) powder at least in the region of the area to be machined. The Teflon (RTM: Polytetrafluoroethylene) powder is introduced into the hollow space with a gelling agent, preferably gelatine. Independent claims are also included for: laser drilling a component, comprising making a through-hole through a wall of a hollow space of the component, and protecting the hollow space; and a hollow component (1), comprising Teflon (RTM: Polytetrafluoroethylene) powder and gelling agent introduced into in a hollow space of the hollow component. |
申请公布号 |
EP2712699(A1) |
申请公布日期 |
2014.04.02 |
申请号 |
EP20120186769 |
申请日期 |
2012.10.01 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
DEGEL, CHRISTOPHER;MASSA, ANDREA;WILKENHOENER, ROLF;WOLLNIK, ADRIAN |
分类号 |
B23K26/38 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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