| 摘要 |
A stacked cooler 24 includes a plurality of refrigerant flow passages 26 and a plurality of semiconductor modules 20 and 22. The refrigerant flow passages 26 and the semiconductor modules 20 and 22 are stacked alternately, and each of opposite surfaces in a stacking direction of each of the semiconductor modules 20 and 22 is in contact with a corresponding one of the refrigerant flow passages 26, thereby cooling the semiconductor modules 20 and 22. The semiconductor modules 20 and 22 generate different amounts of heat. One or a plurality of the semiconductor modules 20 and one or a plurality of the semiconductor module 22 are arranged in each of arrangement spaces adjacent to the refrigerant flow passages 26 so that a difference in amount of heat generated between the respective arrangement spaces becomes small. Consequently, cooling capability is equalized throughout the respective arrangement spaces, enabling reduction in waste due to excessive cooling. |
