| 摘要 |
Provided is a resin-encapsulated semiconductor device which includes a semiconductor element mounted on a die pad part, lead parts which have end parts which face the die pad part, a metal line which touches the lead part and the electrode of the semiconductor element, an encapsulation resin which partly encapsulates them, the lower part of the die pad part exposed from the encapsulation resin, the lower part of the lead part, and the upper side part of an outer side part. A plating layer is formed in the upper end part and the lower part of the exposed lead part. [Reference numerals] (AA) Space part |
