发明名称 Soft lithographic molding of surface relief output couplers for organic light emitting diodes
摘要 The present invention provides a method and apparatus for surface relief output coupling in organic light emitting diodes is provided. The method includes forming a pattern in a surface of an elastomer (310) and laminating at least a portion of the pattern to a surface of an organic light emitting diode (305).
申请公布号 US8685195(B2) 申请公布日期 2014.04.01
申请号 US20070161971 申请日期 2007.01.29
申请人 SHIM ANNE;ROGERS JOHN;HUA FENG 发明人 SHIM ANNE;ROGERS JOHN;HUA FENG
分类号 B29C47/00 主分类号 B29C47/00
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