| 摘要 |
The etching of a sacrificial silicon dioxide (SiO2) portion in a microstructure such as a microelectro-mechanical structures (MEMS) by the use an etchant gas, namely hydrogen fluoride (HF) vapour is performed with greater selectivity to other portions within the MEMS, and in particular portions of silicon nitride (Si3N4). This is achieved by the addition of a secondary non-etchant gas suitable for increase the ratio of difluoride reactive species (HF2- and H2F2) to monofluoride reactive species (F-, and HF) within the HF vapour. The secondary non-etchant gas may comprise a hydrogen compound gas. The ratio of difluoride reactive species (HF2- and H2F2) to the monofluoride reactive species (F-, and HF) within the HF vapour can also be increased by setting an etch operating temperature to 20° C. or below. |
