发明名称 A method of fabricating a multilayer structure with circuit layer transfer
摘要 A method of producing a composite structure comprises a step of producing a first layer of microcomponents on one face of a first substrate, the first substrate being held flush against a holding surface of a first support during production of the microcomponents, and a step of bonding the face of the first substrate comprising the layer of microcomponents onto a second substrate. During the bonding step, the first substrate is held flush against a second support, the holding surface of which has a flatness that is less than or equal to that of the first support used during production of the first layer of microcomponents.
申请公布号 KR101379887(B1) 申请公布日期 2014.04.01
申请号 KR20117021845 申请日期 2010.03.04
申请人 发明人
分类号 H01L21/20;H01L21/762 主分类号 H01L21/20
代理机构 代理人
主权项
地址