发明名称 Silicon carbide semiconductor device
摘要 A silicon carbide layer is epitaxially formed on a main surface of a substrate. The silicon carbide layer is provided with a trench having a side wall inclined relative to the main surface. The side wall has an off angle of not less than 50° and not more than 65° relative to a {0001} plane. A gate insulating film is provided on the side wall of the silicon carbide layer. The silicon carbide layer includes: a body region having a first conductivity type and facing a gate electrode with the gate insulating film being interposed therebetween; and a pair of regions separated from each other by the body region and having a second conductivity type. The body region has an impurity density of 5×1016 cm−3 or greater. This allows for an increased degree of freedom in setting a threshold voltage while suppressing decrease of channel mobility.
申请公布号 US8686435(B2) 申请公布日期 2014.04.01
申请号 US201213434233 申请日期 2012.03.29
申请人 MASUDA TAKEYOSHI;HIYOSHI TORU;WADA KEIJI;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 MASUDA TAKEYOSHI;HIYOSHI TORU;WADA KEIJI
分类号 H01L21/336;H01L29/04;H01L29/12;H01L29/78 主分类号 H01L21/336
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