发明名称 |
Backlight unit comprising a bottom cover including an embossing portion that overlaps with a portion of an LED package and liquid crystal display using the same |
摘要 |
A backlight unit comprises a light emitting diode (LED) package including one or more LED chips, a light source PCB mounting one side of a bottom of the LED package or both sides of the bottom of the LED package, a bottom cover supporting the light source PCB under the light source PCB, and having an embossing portion which protrudes toward the LED package with a size corresponding to the bottom of the LED package which is not mounted on the light source PCB, and a heat emission material filling between the bottom of the LED package and the embossing portion. |
申请公布号 |
US8687142(B2) |
申请公布日期 |
2014.04.01 |
申请号 |
US20100848776 |
申请日期 |
2010.08.02 |
申请人 |
LEE JOOHONG;OH SEOKHWAN;LG DISPLAY CO., LTD. |
发明人 |
LEE JOOHONG;OH SEOKHWAN |
分类号 |
G02F1/1335;F21V7/04;G09F13/04 |
主分类号 |
G02F1/1335 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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