发明名称 Pressure sensor package having a groove provided in a wall surface of the pressure inlet pipe
摘要 An aspect of a pressure sensor package is that a condensed droplet can be prevented from solidifying and blocking the hole of a pressure inlet pipe, without increasing the external dimensions of the package. Aspects of the invention include a groove in a wall surface of a hole of a pressure inlet pipe, a droplet condensed on the wall surface spreads along the groove by a capillary action, and it is possible to prevent the hole of the pressure inlet pipe being blocked by the droplet.
申请公布号 US8683867(B2) 申请公布日期 2014.04.01
申请号 US201113243176 申请日期 2011.09.23
申请人 ASHINO KIMIHIRO;FUJI ELECTRIC CO., LTD. 发明人 ASHINO KIMIHIRO
分类号 G01L7/00;G01L9/00 主分类号 G01L7/00
代理机构 代理人
主权项
地址