发明名称 |
Method of monitoring progress of substrate polishing and polishing apparatus |
摘要 |
A method of monitoring progress of polishing of a substrate having at least two regions including a first region and a second region with different structures is provided. The method includes: applying light to plural measurement points on the substrate during polishing of the substrate; receiving reflected light from each measurement point; measuring intensity of the reflected light; producing a spectrum of the reflected light from the intensity; classifying the spectrum as spectrum of the reflected light from the first region or as spectrum of the reflected light from the second region based on a shape of the spectrum or the intensity of the reflected light; and monitoring progress of polishing of the substrate based on a temporal change in the spectrum of the reflected light from the first region. |
申请公布号 |
US8687197(B2) |
申请公布日期 |
2014.04.01 |
申请号 |
US201113183555 |
申请日期 |
2011.07.15 |
申请人 |
KIMBA TOSHIFUMI;EBARA CORPORATION |
发明人 |
KIMBA TOSHIFUMI |
分类号 |
G01N21/55;B24B37/013;B24B49/12;H01L21/66 |
主分类号 |
G01N21/55 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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