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发明名称
导电性糊用铜粉及导电性糊
摘要
申请公布号
TWI432588
申请公布日期
2014.04.01
申请号
TW100108231
申请日期
2011.03.11
申请人
三井金属鑛业股份有限公司 日本
发明人
织田晃佑;佐佐木卓也;吉丸克彦
分类号
C22C9/10;B22F1/02;H01B1/22
主分类号
C22C9/10
代理机构
代理人
洪武雄 台北市中正区杭州南路1段15之1号9楼;陈昭诚 台北市中正区杭州南路1段15之1号9楼
主权项
地址
日本
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