| 摘要 |
An apparatus configured to create a resistive pathway for an electronic assembly is disclosed. In one embodiment, the pathway can be formed with a resistive film in conjunction with a conductive adhesive and a coverlay. In another embodiment, the resistive film, the conductive adhesive and the coverlay can be relatively transparent. In yet another embodiment, the resistive pathway can couple directly with traces on an electronic assembly saving space and easing assembly. |
