发明名称 |
METHOD FOR FORMING INTERCONNECT IN SOLAR CELL. |
摘要 |
A thin film solar cell and process for forming the same. The solar cell includes a bottom electrode, semiconductor light absorbing layer, and top electrode. Interconnects may be formed between the top and bottom electrodes by electrochemical plating of conductive materials in recessed regions formed between the electrodes. In some embodiments, the conductive materials may be optically opaque metals having non-light transmissive properties. The interconnects are highly conductive and minimize the thickness of the top electrode layer, thereby enhancing light transmission and cell energy conversion performance. |
申请公布号 |
NL2008742(C) |
申请公布日期 |
2014.03.31 |
申请号 |
NL20122008742 |
申请日期 |
2012.05.02 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
YANG HSUAN-SHENG;LEE WEN-CHIN |
分类号 |
H01L21/283;H01L27/142;H01L31/0224;H01L31/0749 |
主分类号 |
H01L21/283 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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