发明名称 METHOD FOR DEPOSITING METALLIC THIN FILM ON A SUBSTRATE
摘要 A method for depositing a metal thin film on a substrate is disclosed. The method for depositing a metal thin film on a substrate, according to the present invention, comprises the steps of mounting a substrate on a substrate mounting stand located inside a vacuum chamber; vacuuming the inside of the vacuum chamber using a vacuum pump; maintaining the internal pressure of the vacuum chamber to be constant by injecting a gas to be used into the vacuum chamber; and applying a bipolar pulsed direct current generated at a bipolar pulsed direct current generator to a magnetron sputtering deposition source mounted on the vacuum chamber.
申请公布号 KR20140038771(A) 申请公布日期 2014.03.31
申请号 KR20120105293 申请日期 2012.09.21
申请人 KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 HAN, SEUNG HEE;KIM, SUNG MIN;MOON, SUN WOO;JANG, JIN HYEOK;KIM, KYUNG HUN
分类号 C23C14/35 主分类号 C23C14/35
代理机构 代理人
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