METHOD FOR DEPOSITING METALLIC THIN FILM ON A SUBSTRATE
摘要
A method for depositing a metal thin film on a substrate is disclosed. The method for depositing a metal thin film on a substrate, according to the present invention, comprises the steps of mounting a substrate on a substrate mounting stand located inside a vacuum chamber; vacuuming the inside of the vacuum chamber using a vacuum pump; maintaining the internal pressure of the vacuum chamber to be constant by injecting a gas to be used into the vacuum chamber; and applying a bipolar pulsed direct current generated at a bipolar pulsed direct current generator to a magnetron sputtering deposition source mounted on the vacuum chamber.
申请公布号
KR20140038771(A)
申请公布日期
2014.03.31
申请号
KR20120105293
申请日期
2012.09.21
申请人
KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
发明人
HAN, SEUNG HEE;KIM, SUNG MIN;MOON, SUN WOO;JANG, JIN HYEOK;KIM, KYUNG HUN