| 摘要 |
A polishing pad includes at least a polishing layer including a groove, on a polishing surface, having side surfaces, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle ± with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle ² with a plane parallel to the polishing surface, the angle ± formed with the polishing surface is larger than 95 degrees, the angle ² formed with the plane parallel to the polishing surface is larger than 95 degrees, and the angle ² formed with the plane parallel to the polishing surface is smaller than the angle ± formed with the polishing surface, and a bending point depth from the polishing surface to a bending point between the first side surface and the second side surface is more than 0.2 mm and not more than 3.0 mm. |
