发明名称 ADHESIVE COMPOSITION, CIRCUIT CONNECTION STRUCTURE, SEMICONDUCTOR DEVICE, AND SOLAR CELL MODULE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition obtainable of sufficient supporting force or temporary fixing force even when the time to temporary fix is short that has excellent adhesive strength after finally connecting. <P>SOLUTION: The adhesive composition contains: acrylic rubber having 5-18 mass% of a structural unit derived from acrylonitrile; urethane acrylate; and a radical polymerization initiator. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 KR101379152(B1) 申请公布日期 2014.03.31
申请号 KR20110071879 申请日期 2011.07.20
申请人 发明人
分类号 C09J9/02;C09J109/02;C09J133/14;H01L31/04 主分类号 C09J9/02
代理机构 代理人
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