发明名称 Method of forming a contact structure and method of manufacturing a semiconductor device using the same
摘要 An insulation layer may be formed on an object having a contact region. The insulation layer may be partially etched to form an opening exposing the contact region. A material layer including silicon and oxygen may be formed on the exposed contact region. A metal layer may be formed on the material layer including silicon and oxygen. The material layer including silicon and oxygen may be reacted with the metal layer to form a metal oxide silicide layer at least on the contact region. A conductive layer may be formed on the metal oxide silicide layer to fill up the opening.
申请公布号 KR101378469(B1) 申请公布日期 2014.03.28
申请号 KR20080042251 申请日期 2008.05.07
申请人 发明人
分类号 H01L21/24;H01L21/28 主分类号 H01L21/24
代理机构 代理人
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