| 摘要 |
Provided is a machining method capable of completely preventing broken fragments of an adhesion sheet from being attached to the surface of a plate-shaped object when the plate-shaped object such as a wafer having an adhesion sheet attached on the rear surface thereof is expanded and segmented. A protective tape (11) having elastic properties is arranged on a surface (1a), and the wafer (1) segmented into each ship (3) along a division-predetermined line is arranged on an expansion tape (13) by interposing the adhesion sheet (12). The adhesion sheet (12) is continuously divided along each chip (3), and a protrusion (12a) of the adhesion sheet (12) protruding towards the outer circumference of the wafer (1) is divided (an expanding step). The protective tape (11) is removed (a protective tape removal step). The broken fragments (12b) of the adhesion sheet (12) generated when the adhesion sheet (12) is segmented are attached to the protective tape (11) so that the present invention prevents the broken fragments (12b) from being attached to the surface (1a) of the wafer (1). |
