发明名称 |
THERMAL INTERFACE MATERIAL COMPOSITION INCLUDING POLYMERIC MATRIX AND CARBON FILLER |
摘要 |
Certain embodiments relate to compositions that may be used as thermal interface materials in electronic assemblies. One such composition includes a block copolymer matrix comprising polystyrene and polybutene. The composition also includes a filler positioned in the copolymer matrix, the filler comprising carbon. The filler may in certain embodiments be a material selected from the group consisting of graphite, graphene, and carbon nanotubes. composition may include routing structures and their formation. Assemblies may include the composition positioned between a die and a heat spreader. Other embodiments are described and claimed. |
申请公布号 |
US2014087200(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201213625612 |
申请日期 |
2012.09.24 |
申请人 |
ARORA HITESH;MATAYABAS, JR. JAMES C. |
发明人 |
ARORA HITESH;MATAYABAS, JR. JAMES C. |
分类号 |
C08L25/08;B32B27/32;B82Y30/00;C08K3/04 |
主分类号 |
C08L25/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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