发明名称 |
METHOD OF DETECTING ABNORMALITY IN POLISHING OF A SUBSTRATE AND POLISHING APPARATUS |
摘要 |
A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range. |
申请公布号 |
US2014087627(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201314034488 |
申请日期 |
2013.09.23 |
申请人 |
EBARA CORPORATION |
发明人 |
TOGAWA TETSUJI;SEKI MASAYA;TAKENAKA HIROYUKI |
分类号 |
B24B37/005;B24B9/06 |
主分类号 |
B24B37/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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