发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
<p>Provided is a photosensitive resin composition which has high film retention ratio after development and high sensitivity, while having a uniform surface after the development. A positive photosensitive resin composition which contains: (a) a polymer that contains a structural unit represented by general formula (1) as a main component; (b) a quinonediazide compound; and (c) a phenolic resin having a specific structure. (In formula (1), each of R1 and R2 independently represents a divalent to octavalent organic group having 2-60 carbon atoms; each of R3, R4, R5 and R6 independently represents a hydrogen atom or a monovalent organic group having 1-20 carbon atoms; each of d and e independently represents an integer of 0-2, provided that d and e are not 0 at the same time; each of f and g independently represents an integer of 0-4; and n represents a positive integer.)</p> |
申请公布号 |
WO2014046062(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
WO2013JP74930 |
申请日期 |
2013.09.13 |
申请人 |
ASAHI KASEI E-MATERIALS CORPORATION |
发明人 |
HONDA, MASAKI;KANADA, TAKAYUKI;YOSHIDA, MASAHIKO;YUNOKUCHI, TOMOSHIGE;OGURA, TOMOHITO |
分类号 |
G03F7/023;C08G8/20;C08G69/26 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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