发明名称 SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To improve inspection efficiency for substrate inspection.SOLUTION: A substrate inspection device comprises: probe units 2a, 2b having a plurality of probes supported by a supporting unit and composed to have respective tip units of respective probes coming into respective contact with respective contact positions of a substrate 100; movement mechanisms 3a, 3b for executing movement processing for moving the probe units 2a, 2b toward the substrate 100; an inspection unit 6 for inspecting the substrate 100 based on electric signals inputted through the probes; and a processing unit 8 for executing a detection process for detecting a deformed state of the substrate 100. In this case, the inspection unit 6 discriminates whether or not respective tip units and respective contact positions are in contact while the movement process is executed by the movement mechanisms 3a, 3b and the processing unit 8 executes a detection processing based on the amount of movement of the probe unit 2a up to the point when respective tip units and respective contact positions are discriminated to be in contact by the inspection unit 6 and a mutual differential value from the supporting unit to respective projection length of respective tip units.
申请公布号 JP2014055818(A) 申请公布日期 2014.03.27
申请号 JP20120200054 申请日期 2012.09.12
申请人 HIOKI EE CORP 发明人 FURUICHI MASASHI
分类号 G01R31/28;H05K3/00 主分类号 G01R31/28
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