| 摘要 |
<p>Technologies are generally described herein for managing heat within a phase change memory (PCM) structure utilizing electrocaloric effect materials. Some example PCM structures may include an electrocaloric effect material layer thermally coupled to an array of PCM cells. The electrocaloric effect material layer may be segmented so that activation of each segment is coordinated with a subset of the PCM cells within the array. While excess heat emanates from a PCM cell during memory operations, a corresponding electrocaloric effect material segment may be activated to decrease the thermal resistance of the electrocaloric effect material, which transfers the excess heat away from the neighboring PCM cells.</p> |
