发明名称 CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 Disclosed herein is a chip device including: a multilayer body having a hexahedral shape; an external electrode covering both distal ends of the multilayer body; and a shape maintaining material contained in the external electrode to maintain a shape of the external electrode at the time of forming the external electrode.
申请公布号 US2014085770(A1) 申请公布日期 2014.03.27
申请号 US201313827397 申请日期 2013.03.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK JUNG TAE;HAN SEUNG HEON;CHOI YOUNG JUN;MOON JI HEE;KIM KI WON;KWAG JOON HWAN
分类号 H01G4/008 主分类号 H01G4/008
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