发明名称 |
CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed herein is a chip device including: a multilayer body having a hexahedral shape; an external electrode covering both distal ends of the multilayer body; and a shape maintaining material contained in the external electrode to maintain a shape of the external electrode at the time of forming the external electrode. |
申请公布号 |
US2014085770(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201313827397 |
申请日期 |
2013.03.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK JUNG TAE;HAN SEUNG HEON;CHOI YOUNG JUN;MOON JI HEE;KIM KI WON;KWAG JOON HWAN |
分类号 |
H01G4/008 |
主分类号 |
H01G4/008 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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