发明名称 |
MULTILAYER CERAMIC ELECTRONIC COMPONENT |
摘要 |
There is provided a multilayer ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the dielectric layers and alternately exposed through both end surfaces of the ceramic body in a length direction of the ceramic body; a first acoustic noise absorption layer formed on one surface of the ceramic body in a stacking direction of the dielectric layers and having a thickness of 3μm to 500μm; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to exposed portions of the first and second internal electrodes; and a printed circuit board having the first and second external electrodes mounted thereon while facing the first acoustic noise absorption layer. |
申请公布号 |
US2014085852(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201313840904 |
申请日期 |
2013.03.15 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK KYU SIK;CHOI JAE YEOL;LEE YOUNG SOOK;PARK MYUNG JUN |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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