发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 There is provided a multilayer ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the dielectric layers and alternately exposed through both end surfaces of the ceramic body in a length direction of the ceramic body; a first acoustic noise absorption layer formed on one surface of the ceramic body in a stacking direction of the dielectric layers and having a thickness of 3μm to 500μm; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to exposed portions of the first and second internal electrodes; and a printed circuit board having the first and second external electrodes mounted thereon while facing the first acoustic noise absorption layer.
申请公布号 US2014085852(A1) 申请公布日期 2014.03.27
申请号 US201313840904 申请日期 2013.03.15
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK KYU SIK;CHOI JAE YEOL;LEE YOUNG SOOK;PARK MYUNG JUN
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项
地址