| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive composition having high heat-resistant adhesiveness and moisture heat-resistant adhesiveness and giving a cured product that exhibits high transparency and high hardness.SOLUTION: The photosensitive composition comprises the following components (1) to (4): (1) a radical initiator (A); (2) an acid generator (B) and/or a base generator (C); (3) a polymerizable substance (D); and (4) a polysiloxane compound (E) having a specified chemical structure. In the composition, at least one of the radical initiator (A), the acid generator (B) and the base generator (C) generates an active species (H) by irradiation with active rays; the active species (H) reacts with (A), (B) or (C) to generate a new active species (I); and (I) promotes a polymerization reaction of the polymerizable substance (D). (H) or (I) is an acid or base. The composition does not substantially contain any of a colorant, a metal oxide powder and a metal powder. (D) comprises an ester compound (D1) having a specified composition and a polyfunctional (meth)acrylate monomer (D2). |
