| 摘要 |
PROBLEM TO BE SOLVED: To provide a retention device and a retention method, in which, when a fluid is blasted from an upper side while a plate-like member such as a wafer having a chamfered portion or the like in its outer periphery is placed on a placing surface, the plate-like member is prevented from being floated and cracked by a reactive force of the fluid.SOLUTION: A retention device 10 comprises regulation means 13 in which, when performing predetermined processing by blasting a fluid from an upper side to a wafer WF placed on a placing surface 12B, the wafer WF is regulated from being floated from the placing surface 12B by a reactive force in the case the fluid flows in from a chamfered portion provided at an outer edge WFA of the wafer WF. The regulation means 13 includes: a recessed groove 22 or a slot 28 which is provided in a support means 12 along the outer edge WFA of the wafer WF; and fluid suction means 23 for sucking the blasted fluid. |
