| 摘要 |
The present invention realizes an applying apparatus rapidly returning from a standby state to a starting state as well as reducing a discharge amount of an applying liquid. In the applying apparatus applying the applying liquid to a substrate, the application of the applying liquid to the substrate is performed by moving a nozzle along a top surface of the substrate while continuously discharging the applying liquid from the nozzle in a state that a corresponding opening is constantly maintained after controlling the opening of an applying liquid passage such that the flow rate of the applying liquid roughly corresponds to a target flow rate, and in a standby state from completion of applying to a new applying, in which the opening of the applying liquid passage is maintained equally to that at the time of applying, a continuous discharge state of the applying liquid from the nozzle is maintained, and a pressure applied to the applying liquid in an applying liquid supply unit is suppressed compared with that at the time of applying, the new application is performed after the pressure applied to the applying liquid in the applying liquid supply unit returns to that at the time of applying and the opening of the applying liquid passage is controlled such that the flow rate of the applying liquid corresponds to the target flow rate. |
