WIRING BOARD AND WIRING BOARD PRODUCTION METHOD

摘要

In the present invention, a wiring board is provided with a first substrate that has a solder fill hole on at least a first surface, and a second substrate that is joined with the first substrate and that has a solder fill hole on at least a first surface. The first and second substrates are electrically connected to each other. A first surface on which a portion of the surface of the first substrate mask can be disposed and a first surface on which another portion of the surface of the second substrate mask can be disposed are flush with each other.