| 发明名称 |
BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF FORMING THE SAME |
| 摘要 |
A bump structure may include a body portion spaced apart from a pad disposed on a substrate and a first extension extending from a side of the body portion onto the pad. A second extension extends from another side of the body portion. |
| 申请公布号 |
US2014084457(A1) |
申请公布日期 |
2014.03.27 |
| 申请号 |
US201314014300 |
申请日期 |
2013.08.29 |
| 申请人 |
CHO MOON GI;KIM YOUNG LYONG;PARK SUN-HEE;LIM HWAN-SIK |
发明人 |
CHO MOON GI;KIM YOUNG LYONG;PARK SUN-HEE;LIM HWAN-SIK |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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