| 摘要 |
The invention concerns a method for producing a smart card or telecommunication module (M2M, SIM) electronic housing (1A, 1A and 1C), comprising an electronic chip (2) in the housing, a face (3) comprising at least one set of conductive metal platings (4), said method comprising the following steps: providing or producing at least one set of metal platings (4) comprising conductive circuit pads or tracks, on one side (9) of a substrate (5), transferring and connecting a chip (2) to each set of platings, overmoulding each chip (1) with the set of metal platings of same on the substrate with a moulding material (7) in order to produce at least one housing, separating the housing from the substrate thereof, characterised in that the side (9) of the substrate (5) in contact with the metal platings comprises an adhesive or has low adhesiveness and in that the overmoulding is carried out at the final dimensions of the housing. The invention also concerns a moulding apparatus and the housing obtained. |
