METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND DEVICE FOR PRODUCING SEMICONDUCTOR

摘要

This method for producing a semiconductor device is provided with: a bump formation step for forming, at a semiconductor chip (1), a bump electrode (100) protruding in an approximately conical shape; a pad formation step for forming, at a substrate (10), a pad electrode (200) having a concavity (210) of which the inner surface is an approximately conical shape or polygonal prism shape; a pressure application step for applying pressure in the direction causing the bump electrode (100) and pad electrode (200) to approach each other in the state of the bump electrode (100) being inserted into the concavity (210), resulting in the state of the central axis of the bump electrode (100) and the central axis of the concavity (210) matching each other; and an ultrasonic joining step for causing the bump electrode (100) and/or pad electrode (200) to vibrate by means of ultrasonic waves, joining the bump electrode (100) and the pad electrode (200).