发明名称 COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 A compound semiconductor device includes as compound semiconductor layers: a first layer; a second layer larger in band gap than the first layer, formed above the first layer; a third layer having a p-type conductivity type, formed above the second layer; a gate electrode formed above the second layer via the third layer; a fourth layer larger in band gap than the second layer, formed to be in contact with the third layer above the second layer; and a fifth layer smaller in band gap than the fourth layer, formed to be in contact with the third layer above the fourth layer.
申请公布号 US2014084339(A1) 申请公布日期 2014.03.27
申请号 US201313942773 申请日期 2013.07.16
申请人 FUJITSU LIMITED 发明人 NISHIMORI MASATO;IMADA TADAHIRO;OHKI TOSHIHIRO
分类号 H01L29/12;H01L21/02 主分类号 H01L29/12
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