| 摘要 |
1,084,939. Soldering. BROWN, BOVERI & CO. Ltd. June 22, 1966 [June 24, 1965], No. 27940/66. Heading B3R. [Also in Division H1] To secure a semi-conductor device to a housing member 9 of a material of markedly different thermal expansion coefficient from that of a mounting plate 8 to which the semiconductor is bonded, the mounting plate 8 is soft soldered at its centre to the member 9 and at its periphery to an annular washer 10 of like expansion coefficient to the plate. The washer is itself hard soldered to the housing member. The device 1 shown is an alloy junction silicon diode, the plate 8 and washer 10 are of molybdenum and the housing member 9 is of copper. 10 is secured to 9 by Ag-Cu solder and 8 to both 9 and 10 by Au-Sn solder. The member 9 forms the base of a sealed enclosure (not shown).
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