| 摘要 |
The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule. |
