发明名称 |
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND CIRCUIT BOARD |
摘要 |
Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15μm; (B) aluminum oxide particles having an average particle size (D50) of 1.5μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%. |
申请公布号 |
US2014087614(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201214115306 |
申请日期 |
2012.04.27 |
申请人 |
PANASONIC CORPRORATION;PANASONIC CORPORATION |
发明人 |
MATSUDA TAKASHI;NISHINO MITSUYOSHI;KOMORI KIYOTAKA |
分类号 |
C08K3/00;C08L63/00;H05K1/03 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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