Method for producing adhesive bond for two components, involves supplying cutting thread in device with application of adhesive beads, where cutting thread is wetted with adhesive and is pressed against component

摘要

The method involves arranging two components parallel to a cutting thread (5) at a required point for joining through a circumferential bead of adhesive (4). The adhesive bead is applied on one component by a device with an adhesive application nozzle, while the component is moved parallel to the cutting thread. The cutting thread is supplied in the device with the application of the adhesive beads. The cutting thread is wetted with the adhesive and is pressed against the component. An independent claim is included for an apparatus for carrying out the adhesive bond production method.