| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for an electromagnetic wave shield which enhances design flexibility of a circuit board, achieves a lightweight and thin board and has good shape followability for an electronic component having a ruggedness of 500 μm or more, and a method for coating an electronic component by using the film for an electromagnetic wave shield.SOLUTION: The film for an electromagnetic wave shield is used to cover ruggedness on a circuit board and comprises a substrate layer and an insulating layer and an electromagnetic wave shielding layer deposited on one surface of the substrate layer. The substrate layer comprises a laminate having at least two layers deposited. |
