发明名称 TRANSMISSION DEVICE AND MANUFACTURING AND TRANSMISSION METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a device and method for reducing the vibration of a signal processing board and transmitting a millimeter wave signal between signal processing boards at high speed without using a connector and cable.SOLUTION: A transmission device of the present invention comprises: a first signal processing board 101 for processing a millimeter wave signal; a second signal processing board 201 signal-coupled with the first signal processing board 101 and used to receive and then process a millimeter wave signal; and a viscoelastic member 107 provided between the first signal processing board 101 and the second processing board 201 and having a prescribed dielectric constant and a prescribed dielectric tangent, the viscoelastic member 107 configuring a dielectric transmission path. Due to this configuration, the viscoelastic member 107 absorbs vibration when an external force is applied to the signal processing boards 101 and 201, so that the vibration of the signal processing board 101 and the second processing board 201 can be reduced, making it possible to transmit a millimeter wave signal between the signal processing boards via the viscoelastic member 107 at high speed without using a connector and cable.
申请公布号 JP2014057313(A) 申请公布日期 2014.03.27
申请号 JP20130192436 申请日期 2013.09.17
申请人 SONY CORP 发明人 KAWAMURA HIROFUMI;OKADA YASUHIRO
分类号 H01P3/16;G01S7/02;G01S7/03;H04B3/52 主分类号 H01P3/16
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