Method for manufacturing semiconductor module, involves carrying out removal of adhesive upper surface of circuit carrier, locating projections from bottom face of carrier, and inserting circuit carrier in through-holes of adhesion carrier

摘要

The method involves processing a circuit carrier (2) during maintaining quasi-benefits. An adhesive upper face (32) of the circuit carrier is removed. An adhesion carrier (3) is formed with multiple through-holes (35) that are continuously extended from the upper face and a bottom face (33) of the circuit carrier. Removal of the adhesive upper surface of the circuit carrier is carried out by a release tool. Multiple projections are located from the bottom face of the circuit carrier that is formed below the circuit carrier. The circuit carrier is inserted in the through-holes.