| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition which forms a cured product (sealing material) which has high heat resistance, light resistance and thermal shock resistance and can improve conduction characteristics and reflow resistance in an optical semiconductor device at a high temperature.SOLUTION: There is provided a curable epoxy resin which includes a nucleus-hydrogenated bisphenol A type epoxy compound (A) and a monoallyl diglycidyl isocyanurate compound (B) represented by the following formula (1), wherein the curable epoxy resin further preferably includes a curing agent (C) and a curing accelerator (D) or a curing catalyst (E). [wherein, Rand Rare the same or different and represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.] |
