发明名称 POLYIMIDE AND MOLDED BODY THEREOF
摘要 <p>The present invention addresses the problem of providing: a polyimide which has excellent transparency, high heat resistance and low linear thermal expansion coefficient at the same time, while exhibiting solvent workability (excellent solubility and film formation performance) by means of a low moisture-absorbing solvent; and a method for producing this polyimide. In order to solve the above-mentioned problem, the present invention provides a polyimide that contains a constituent unit represented by formula (1). (In the formula, each R independently represents a hydrogen atom or an alkyl group having 1-6 carbon atoms, provided that at least one of two R groups bonded to a same benzene ring is an alkyl group.)</p>
申请公布号 WO2014046180(A1) 申请公布日期 2014.03.27
申请号 WO2013JP75300 申请日期 2013.09.19
申请人 HONSHU CHEMICAL INDUSTRY CO., LTD.;TOHO UNIVERSITY 发明人 ISHII JUNICHI;HASEGAWA MASATOSHI
分类号 C08G73/16;C08J5/18 主分类号 C08G73/16
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