发明名称 |
ADHESIVE COMPOSITION, ADHESIVE FILM, AND BONDING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition capable of suppressing warpage of a laminate when the laminate is subjected to a heating process.SOLUTION: An adhesive composition includes an elastomer as a main component, and an adhesive layer prepared from the adhesive composition satisfies at least one of following conditions: a storage modulus (G') of 20,000 Pa or more at 220°C; and a loss modulus (G'') of 20,000 Pa or more at 220°C. |
申请公布号 |
JP2014055280(A) |
申请公布日期 |
2014.03.27 |
申请号 |
JP20130117292 |
申请日期 |
2013.06.03 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
NOGUCHI TAKUYA;OGATA HISAYUKI;KUBO ATSUSHI;IMAI HIROFUMI;YOSHIOKA TAKAHIRO |
分类号 |
C09J201/00;B32B27/00;B32B27/30;C09J7/02;C09J125/08;C09J153/00 |
主分类号 |
C09J201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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