发明名称 ADHESIVE COMPOSITION, ADHESIVE FILM, AND BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition capable of suppressing warpage of a laminate when the laminate is subjected to a heating process.SOLUTION: An adhesive composition includes an elastomer as a main component, and an adhesive layer prepared from the adhesive composition satisfies at least one of following conditions: a storage modulus (G') of 20,000 Pa or more at 220°C; and a loss modulus (G'') of 20,000 Pa or more at 220°C.
申请公布号 JP2014055280(A) 申请公布日期 2014.03.27
申请号 JP20130117292 申请日期 2013.06.03
申请人 TOKYO OHKA KOGYO CO LTD 发明人 NOGUCHI TAKUYA;OGATA HISAYUKI;KUBO ATSUSHI;IMAI HIROFUMI;YOSHIOKA TAKAHIRO
分类号 C09J201/00;B32B27/00;B32B27/30;C09J7/02;C09J125/08;C09J153/00 主分类号 C09J201/00
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