PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A package structure comprises a substrate, a plurality of first electronic components, at least a second electronic component, a first covering layer and a wiring layer. A surface of the substrate includes a first region and a second region. The first electronic components are disposed in the first region, wherein at least one of the first electronic components has a first conductive contact. The second electronic component is disposed in the second region. The first covering layer includes a recess and a first exposing region for exposing the first conductive contact. The wiring layer is formed on the recess and electronically coupled to the first conductive contact.