| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device manufacturing method, a semiconductor component mounting structure, and a circuit device capable of reinforcing a junction with resin in a narrow space and having excellent mounting junction rate after joining, making it possible to restrain the occurrence of a void.SOLUTION: A semiconductor component 3 provided with a solder-supplied conductive connection member 4 is prepared, and a coating of side-filling thermosetting resin composition 6a containing an organic acid as active agent is applied in advance to a range along a side periphery 3a of the semiconductor component 3 in a portion of a circuit board 1 where the semiconductor component 3 is mounted. Reflow processing is performed while being interposed between the semiconductor component 3 and the circuit board 1 abutting on a junction structure 7 between the conductive connection member 4 disposed at least on the outermost side along the side periphery 3a of the semiconductor component 3 and a land 2, whereby connection by solder between the conductive connection member 4 and the land 2 and formation of a side fill 6b by curing of the side-filling thermosetting resin composition 6a are carried out at the same time. |
