发明名称 |
COMPLIANT THERMAL CONTACT DEVICE AND METHOD |
摘要 |
Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations. |
申请公布号 |
US2014084953(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201213625334 |
申请日期 |
2012.09.24 |
申请人 |
DIGLIO PAUL;SONG DAVID W. |
发明人 |
DIGLIO PAUL;SONG DAVID W. |
分类号 |
G01R31/26;F28F7/00 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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